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Etching tanks used to perform Piranha, hydrofluoric acid or RCA clean on 4-inch wafer batches at LAAS technological facility in Toulouse, France
Etching tanks used to perform Piranha, hydrofluoric acid or RCA clean on 4-inch wafer batches at LAAS technological facility in Toulouse, France
Radiation hardened die of the 1886VE10 microcontroller prior to metalization etching
Radiation hardened die of the 1886VE10 microcontroller prior to metalization etching
Radiation hardened die of the 1886VE10 microcontroller after a metalization etching process has been used
Radiation hardened die of the 1886VE10 microcontroller after a metalization etching process has been used
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2-inch (51 mm), 4-inch (100 mm), 6-inch (150 mm), and 8-inch (200 mm) wafers
2-inch (51 mm), 4-inch (100 mm), 6-inch (150 mm), and 8-inch (200 mm) wafers
Image: Siliziumwafer
Image: Siliziumwafer
Image: Wafers on the conveyor (3347741252)
Image: Wafers on the conveyor (3347741252)
Image: Solar World wafer (3347743800)
Image: Solar World wafer (3347743800)