Metal whiskering is a phenomenon that occurs in electrical devices when metals form long whisker-like projections over time. Tin whiskers were noticed and documented in the vacuum tube era of electronics early in the 20th century in equipment that used pure, or almost pure, tin solder in their production. It was noticed that small metal hairs or tendrils grew between metal solder pads, causing short circuits. Metal whiskers form in the presence of compressive stress. Germanium, zinc, cadmium, and even lead whiskers have been documented. Many techniques are used to mitigate the problem, including changes to the annealing process, the addition of elements like copper and nickel, and the inclusion of conformal coatings. Traditionally, lead has been added to slow down whisker growth in tin-based solders.

Gold plating is a method of depositing a thin layer of gold onto the surface of another metal, most often copper or silver, by chemical or electrochemical plating. Plating refers to modern coating methods, such as the ones used in the electronics industry, whereas gilding is the decorative covering of an object with gold, which typically involve more traditional methods and much larger objects.