Ball grid array
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A ball grid array is a type of surface-mount packaging used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection
A grid array of solder balls on a printed circuit board after removal of an integrated circuit chip
Cross-cut section of BGA mounted circuit
BGA ICs assembled on a memory module
X-ray of BGA
Pin grid array
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A pin grid array is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are arranged in a regular array on the underside of the package. The pins are c
Closeup of the pins of a pin grid array
The pin grid array at the bottom of prototype Motorola 68020 microprocessor
The pin grid array on the bottom of an AMD Phenom X4 9750 processor that uses the AMD AM2+ socket
Underside of an 80486 with lid removed shows die and wire bonded connections.