A pin grid array (PGA) is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are arranged in a regular array on the underside of the package. The pins are commonly spaced 2.54 mm (0.1") apart, and may or may not cover the entire underside of the package.
Closeup of the pins of a pin grid array
The pin grid array at the bottom of a XC68020, a prototype of the Motorola 68020 microprocessor
The pin grid array on the bottom of an AMD Phenom X4 9750 processor that uses the AMD AM2+ socket
Underside of an 80486 with lid removed shows die and wire bonded connections.
Integrated circuit packaging
Integrated circuit packaging is the final stage of semiconductor device fabrication, in which the die is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the device to a circuit board.
Dual in-line (DIP) integrated circuit metal lead frame tape with contacts
Various IC packages (left to right): TSSOP-32, TQFP-100, SO-20, SO-14, SSOP-28, SSOP-16, SO-8, QFN-28
Small-outline integrated circuit. This package has 16 "gull wing" leads protruding from the two long sides and a lead spacing of 0.050 inches.
Early USSR-made integrated circuit. The tiny block of semiconducting material (the "die"), is enclosed inside the round, metallic case (the "package").
