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Closeup of the pins of a pin grid array
Closeup of the pins of a pin grid array
The pin grid array at the bottom of a XC68020, a prototype of the Motorola 68020 microprocessor
The pin grid array at the bottom of a XC68020, a prototype of the Motorola 68020 microprocessor
The pin grid array on the bottom of an AMD Phenom X4 9750 processor that uses the AMD AM2+ socket
The pin grid array on the bottom of an AMD Phenom X4 9750 processor that uses the AMD AM2+ socket
Underside of an 80486 with lid removed shows die and wire bonded connections.
Underside of an 80486 with lid removed shows die and wire bonded connections.
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Dual in-line (DIP) integrated circuit metal lead frame tape with contacts
Dual in-line (DIP) integrated circuit metal lead frame tape with contacts
Various IC packages (left to right): TSSOP-32, TQFP-100, SO-20, SO-14, SSOP-28, SSOP-16, SO-8, QFN-28
Various IC packages (left to right): TSSOP-32, TQFP-100, SO-20, SO-14, SSOP-28, SSOP-16, SO-8, QFN-28
Small-outline integrated circuit. This package has 16 "gull wing" leads protruding from the two long sides and a lead spacing of 0.050 inches.
Small-outline integrated circuit. This package has 16 "gull wing" leads protruding from the two long sides and a lead spacing of 0.050 inches.
Early USSR-made integrated circuit. The tiny block of semiconducting material (the "die"), is enclosed inside the round, metallic case (the "package")
Early USSR-made integrated circuit. The tiny block of semiconducting material (the "die"), is enclosed inside the round, metallic case (the "package").