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4000-series logic ICs in 0.3" wide 14-pin plastic DIP packages (DIP-14N), also known as PDIP (Plastic DIP)
4000-series logic ICs in 0.3" wide 14-pin plastic DIP packages (DIP-14N), also known as PDIP (Plastic DIP)
EPROM ICs in 0.6" wide ceramic DIP-40, DIP-32, DIP-28, DIP-24 packages, also known as CDIP (Ceramic DIP)
EPROM ICs in 0.6" wide ceramic DIP-40, DIP-32, DIP-28, DIP-24 packages, also known as CDIP (Ceramic DIP)
Eight-contact DIP switch with 0.3" wide 16-pin (DIP-16N) footprint
Eight-contact DIP switch with 0.3" wide 16-pin (DIP-16N) footprint
An operating prototyped circuit on a solderless breadboard incorporating four DIP ICs, a DIP LED bargraph display (upper left), and a DIP 7-segment LE
An operating prototyped circuit on a solderless breadboard incorporating four DIP ICs, a DIP LED bargraph display (upper left), and a DIP 7-segment LED display (lower left)
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This replica of the first laboratory transistor shows connecting leads and a glass jar for protection; packaging the device was critical to its succes
This replica of the first laboratory transistor shows connecting leads and a glass jar for protection; packaging the device was critical to its success.
A hybrid integrated circuit
A hybrid integrated circuit
Assorted discrete through-hole components
Assorted discrete through-hole components
A silicon wafer; individual devices (VLSI in squares) are not usable until diced, wire-bonded, and packaged
A silicon wafer; individual devices (VLSI in squares) are not usable until diced, wire-bonded, and packaged