The entire wiki reimagined as a visual magazine with video discovery · Watch your interests come alive
The entire wiki reimagined as a visual magazine with video discovery · Watch your interests come alive
This replica of the first laboratory transistor shows connecting leads and a glass jar for protection; packaging the device was critical to its succes
This replica of the first laboratory transistor shows connecting leads and a glass jar for protection; packaging the device was critical to its success.
A hybrid integrated circuit
A hybrid integrated circuit
Assorted discrete through-hole components
Assorted discrete through-hole components
A silicon wafer; individual devices (VLSI in squares) are not usable until diced, wire-bonded, and packaged
A silicon wafer; individual devices (VLSI in squares) are not usable until diced, wire-bonded, and packaged
Dual in-line (DIP) integrated circuit metal lead frame tape with contacts
Dual in-line (DIP) integrated circuit metal lead frame tape with contacts
Various IC packages (left to right): TSSOP-32, TQFP-100, SO-20, SO-14, SSOP-28, SSOP-16, SO-8, QFN-28
Various IC packages (left to right): TSSOP-32, TQFP-100, SO-20, SO-14, SSOP-28, SSOP-16, SO-8, QFN-28
Small-outline integrated circuit. This package has 16 "gull wing" leads protruding from the two long sides and a lead spacing of 0.050 inches.
Small-outline integrated circuit. This package has 16 "gull wing" leads protruding from the two long sides and a lead spacing of 0.050 inches.
Early USSR-made integrated circuit. The tiny block of semiconducting material (the "die"), is enclosed inside the round, metallic case (the "package")
Early USSR-made integrated circuit. The tiny block of semiconducting material (the "die"), is enclosed inside the round, metallic case (the "package").