Flip chip
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Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and micro
Intel Mobile Celeron in a flip-chip BGA package (FCBGA-479); the BGA package substrate or flip-chip substrate, also called a BGA or flip-chip interposer, is dark yellow, and the silicon die appears dark blue.
Underside of a die from a flip-chip package, the top metal layer on the IC die or top metallization layer, and metallized pads for flip-chip mounting are visible
Flip-Chip module
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A Flip-Chip module is a component of digital logic systems made by the Digital Equipment Corporation for its PDP-7, PDP-8, PDP-9, and PDP-10 computers, and related peripherals, beginning on August 24,
Flip chip
…helped transition the industry away from ceramic substrates, and this film is now essential in the production of organic flip-chip package substrates. Flip-Chip modules – Digital Equipment Corporation trademarked version Hybrid pixel detector…
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R107 from a TU55 DECtape drive; this board holds seven inverters, each built from one transistor, two diodes, and a hybrid integrated circuit built using flip chip technology.
DEC PDP-8/E minicomputer, built from multiple quad-height M-series modules