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Intel Mobile Celeron in a flip-chip BGA package (FCBGA-479); the silicon die appears dark blue
Intel Mobile Celeron in a flip-chip BGA package (FCBGA-479); the silicon die appears dark blue
Underside of a die from a flip chip package, the top metal layer on the IC die or top metallization layer, and metallized pads for flip chip mounting
Underside of a die from a flip chip package, the top metal layer on the IC die or top metallization layer, and metallized pads for flip chip mounting are visible
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A microscope image of an integrated circuit die used to control LCDs. The pinouts are the dark circles surrounding the integrated circuit.
A microscope image of an integrated circuit die used to control LCDs. The pinouts are the dark circles surrounding the integrated circuit.
Jack Kilby's original integrated circuit. The world's first IC. Made from germanium with gold-wire interconnects.
Jack Kilby's original integrated circuit. The world's first IC. Made from germanium with gold-wire interconnects.
A-to-D converter IC in a DIP
A-to-D converter IC in a DIP
The die from an Intel 8742, an 8-bit NMOS microcontroller that includes a CPU running at 12 MHz, 128 bytes of RAM, 2048 bytes of EPROM, and I/O in the
The die from an Intel 8742, an 8-bit NMOS microcontroller that includes a CPU running at 12 MHz, 128 bytes of RAM, 2048 bytes of EPROM, and I/O in the same chip