Multi-chip module
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A multi-chip module is generically an electronic assembly where multiple integrated circuits, semiconductor dice and/or other discrete components are integrated, usually onto a unifying substrate, so
A ceramic multi-chip module containing four POWER5 processor dice (center) and four 36 MB L3 cache dice (periphery)
Flip chip
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Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and micro
Multi-chip module
…modularity and/or to improve yields over a conventional monolithic IC approach. A Flip Chip Multi-Chip Module (FCMCM) is a multi-chip module that uses flip chip technology. A FCMCM may have one large die and several smaller dice all on the same module. Multi-chip modules come in a variety of forms depending on…
Intel Mobile Celeron in a flip-chip BGA package (FCBGA-479); the BGA package substrate or flip-chip substrate, also called a BGA or flip-chip interposer, is dark yellow, and the silicon die appears dark blue.
Underside of a die from a flip-chip package, the top metal layer on the IC die or top metallization layer, and metallized pads for flip-chip mounting are visible