Printed circuit board manufacturing is the process of manufacturing bare printed circuit boards and populating them with electronic components. It includes all the processes to produce the full assemb
PCBs in process of having copper pattern plated (note the blue dry film resist)
A board designed in 1967; the sweeping curves in the traces are evidence of freehand design using adhesive tape
PCB copper electroplating line in the process of pattern plating copper
Cut through a SDRAM-module, a multi-layer PCB (BGA mounted). Note the via, visible as a bright copper-colored band running between the top and bottom layers of the board.
Ball grid array
Videos
A ball grid array is a type of surface-mount packaging used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection
A grid array of solder balls on a printed circuit board after removal of an integrated circuit chip
BGA ICs assembled on a memory module
X-ray of BGA