A small outline integrated circuit is a surface-mounted integrated circuit package which occupies an area about 30–50% less than an equivalent dual in-line package, with a typical thickness being 70%
SOIC-16
A PIC microcontroller (wide SOIC-28) in a ZIF socket
SOJ package
Hynix flash memory as TSOP
Quad flat package
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A quad flat package is a surface-mounted integrated circuit package with "gull wing" leads extending from each of the four sides. Socketing such packages is rare and through-hole mounting is not possi
144-pin low profile quad flat package (LQFP)
80-pin thin quad flat package (TQFP) – PIC microcontroller
304-pin plastic quad flat package (QFP) with exposed thermal pad (TP)
100-pin bumpered quad flat package (BQFP) – Cyrix Cx486SLC